1.

High-productivity COG bonding system for 1.5”~8.4” LCD Panels

2.

All-in-one, space-saving machine which can handle ACF attaching, chip pre-bonding and main-bonding

3.

High-reliable alignment and bonding system

4.

Chip supply can be set to a magazine in the tray of each size with a face up

5.

High accuracy is guaranteed by pattern recognition system

6.

High throughput

7.

Easy operating interface, CIM interface available