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::GPM 產品介紹::
全自動晶片黏晶機
http://www.gpmcorp.com.tw/upload/website/product/normal/gpm_20141024084743_418301.jpg
KB-5600
  • High reliability and high accuracy by Non-Contact Fine Die alignment system.
  • Device data memory capability is up to 1000 kinds..
  • Production management control & self-diagnosis function.
  • Si substrate bonding function is available.
  • Wafer mapping function is available.

       均華精密
石敦智

T: 886-3-5639999#2201

E:stone@gpmcorp.com.tw

均華精密
張欽華 

T: 886-2-22682216#2001

E:algo@gpmcorp.com.tw



規格

Machine Cycle Time 

≦1.6 sec. (excluding pick and place delay time)

Pick & Place Accuracy

X/Y: ±10μm, θ: ± 0.5°

Bonding Accuracy X/Y: ± 10μm, θ: ± 0.5°