- High reliability and high accuracy by Non-Contact Fine Die alignment system.
- Device data memory capability is up to 1000 kinds..
- Production management control & self-diagnosis function.
- Si substrate bonding function is available.
- Wafer mapping function is available.
KB-5600
 |
均華精密 石敦智 |
T: 886-3-5639999#2201 |
均華精密 張欽華 |
T: 886-2-22682216#2001 |
| 規格 | |
|---|---|
|
Machine Cycle Time |
≦1.6 sec. (excluding pick and place delay time) |
|
Pick & Place Accuracy |
X/Y: ±10μm, θ: ± 0.5° |
| Bonding Accuracy | X/Y: ± 10μm, θ: ± 0.5° |
|
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