● 對應不同的製程,客製化調整檢測需求
● 人工智能-自動缺陷檢測和分類
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| Wafer Size | 4"~12"/ panel size ~700m x700mm |
| Topography | 0.12nm |
| Measurement items | roughness, step height, film thickness, surface topography, CD |
| Wafer Size | 4”~12”/ panel size ~700mm x700mm |
| Inspection Items(dicing) | inner crack, side wall crack, topside crack, backside crack, dicing slant |
| Measurement Items(TGV) | Panel Dimension, surface appearance, laser modificaion qulity, TGV etching metrologies, seed layer qulity, glass dicing qulity |