[Grinding] IC Substrate Planarization Grinder - Product Information
- Fully automated production; the automatic load/unload system reduces staff requirement for the operation and increases equipment output
- Multi-unit production increases the flexibility of production output planning and process allocation
- Auto measure and dressing system measures the difference between grinding wheel diameter and compensation value after dressing automatically, monitoring the life of materials
- In-line auto measurement, capable of compensating for the target thickness before the finishing grind
- The inspection station feeds the measurement back to the grinding system, improving the precision of target parameters
- The intelligent diagnosis system collects production data, analyzes the data with in-house algorithms, and reports the status of the equipment in real-time
