[Surface Polishing Tool] Reclaim CMP – Product Information
●Full Auto Wafer Polishing, Dry-in / Dry-out (DIDO).
●High Utilization Rate: Polishing stations function independently & can be individually bypassed.
●Process Flexibility: Polishing stations can process individually (in parallel) or together in succession (in series).
●Multi-zone/multi-step pressure application & integrated multi-step cleaning system.
●Main Application: Wafer Reclaim
Supported size: Ø300mm
Polishing material: Silicon (Si)


Panel Polisher
●The upper and lower platens are made of special steel, providing high compressive and tensile strength to prevent deformation.
●Automatic pressure compensation ensures stable polishing pressure.
●Integrated automatic LD/ULD system increase equipment utilization.

● Explosion-proof and anti-static design for all tanks, piping, and mechanical structures; supports integrated CO2 fire suppression for enhanced safety.
● The software is all developed and designed by GPM, It can be modified in real time according to the requirements of the process & equipment department
● Adjustable bench flow field, vertical agitation, and wafer rotation functions: Enhances reaction kinetics and stripping performance, improves etching uniformity, and optimizes development consistency.

● Customized adjustments to measurement and inspection requirements to correspond to different processes
● Artificial Intelligence-Defect/Object Detection & Defect/Object Classification

Strip Grinder
●Automatic thickness measurement, full panel measurement support
●Automatic grinding wheel sharpening, automatic thickness compensation
●Multi-mode water supply system, external water supply mode, circulating water supply mode
●Thickness measurement mechanism: contact probe + non-contact gauge(TCG+NCG)