● EQ meets explosion-proof and static conductive design, high safety
● The software is all developed and designed by GPM, It can be modified in real time according to the requirements of the process & equipment department
● Adjustable laminar flow plate/Agitation /Wafer Rotation Function Improve etching uniformity

● Customized adjustments to measurement and inspection requirements to correspond to different processes
● Artificial Intelligence-Defect/Object Detection & Defect/Object Classification

In-feed Grinder
● High precision final thickness measurement measure multi-points
● Automated equipment, could load/unload automatically by LD/ULD
● Composite material strip grinding process
● Combine big data and analysis grinding parameter and predict maintenance time.

Strip Grinder
●Automatic thickness measurement, full panel measurement support
●Automatic grinding wheel sharpening, automatic thickness compensation
●Multi-mode water supply system, external water supply mode, circulating water supply mode
●Thickness measurement mechanism: contact probe + non-contact gauge(TCG+NCG)

Panel Polisher
●The upper and lower platens are made of special steel, providing high compressive and tensile strength to prevent deformation.
●Automatic pressure compensation ensures stable polishing pressure.
●Integrated automatic LD/ULD system increase equipment utilization.