[Surface Polishing Tool] Reclaim CMP – Product Information
●Full Auto Wafer Polishing, Dry-in / Dry-out (DIDO).
●High Utilization Rate: Polishing stations function independently & can be individually bypassed.
●Process Flexibility: Polishing stations can process individually (in parallel) or together in succession (in series).
●Multi-zone/multi-step pressure application & integrated multi-step cleaning system.
●Main Application: Wafer Reclaim
Supported size: Ø300mm
Polishing material: Silicon (Si)
Panel Polisher
●The upper and lower platens are made of special steel, providing high compressive and tensile strength to prevent deformation.
●Automatic pressure compensation ensures stable polishing pressure.
●Integrated automatic LD/ULD system increase equipment utilization.
