Wet Process

Flat Panel Display

● Uses high-performance bubble jet to improve particle removal rate
● Uses specialized roller brushes to improve particle removal rate and reduce chipping rate
● Modular design, easy to maintain
● User-friendly MMI interface that is easy to operate, reducing operational incidents
● CIM interface is available for tracking problems in the process

01After Slimming 02Before Lamination 03After Grinding 04Before Deposition 05Incoming 06ITO Etching 07Gate/Source/ITO

Substrate Size	G3 ~6
Substrate Thickness	0.1~0.5 t

Substrate Size	7”~110”
Substrate Thickness	0.1~0.5 t

Substrate Size	G2 ~10.5
Substrate Thickness	0.1~0.5 t

Substrate Size	G3 ~G10.5
Substrate Thickness	0.3~1.1 t

Substrate Size	G3 ~G10.5
Substrate Thickness	0.3~1.1 t

Substrate Size	G5~G6
Substrate Thickness	0.3~1.1 t

Substrate Size	G10.5
Substrate Thickness	0.3~1.1t

Relevant Products

AOI

● Market leader for all types and sizes
● Planning can be integrated to any buffer, cassette, drawer, review station, overhead conveyor, or NG port
● Configurable software based on user requirements
● Data can be uploaded to CIM systems or exported to any format
● Real-time support and training

Grinding

● Single or Double column x-axis grinding feeding
● Area CCD or Line Scan inspection (optional)
● DD motor compensation or patented compensation (optional)
● Fixed / Variable side bar Stage

Prober

● Fully automatic panel loading and unloading
● Customized scope for LCDs
● Customized prober card for EL testing
● Automatic recipe compensation after changing the prober card
● Auto Teaching Function
● Auto Clean Function

Lamination

● Attaching speed: could be adjusted according to location and speed, section by section, and achieve optimal attachment quality
● High-precision laminating and high-precision alignment correction system